Title:
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/217638
Kind Code:
A1
Abstract:
The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.
Inventors:
LEE YOON MAN (KR)
KIM JAE HYUN (KR)
EOM TAE SHIN (KR)
LEE EUN JUNG (KR)
IM SU MI (KR)
KIM JAE HYUN (KR)
EOM TAE SHIN (KR)
LEE EUN JUNG (KR)
IM SU MI (KR)
Application Number:
PCT/KR2017/001662
Publication Date:
December 21, 2017
Filing Date:
February 15, 2017
Export Citation:
Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
C08L63/00; C08G59/02; C08J3/12; C08J3/20; H01L33/56
Foreign References:
| JPH10292094A | 1998-11-04 | |||
| KR20130114113A | 2013-10-16 | |||
| KR20090082141A | 2009-07-29 | |||
| JP2002327044A | 2002-11-15 | |||
| KR100287491B1 | 2001-04-16 |
Attorney, Agent or Firm:
AJU INT'L LAW & PATENT GROUP (KR)
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