Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE MADE WITH THE SAME
Document Type and Number:
WIPO Patent Application WO/2004/065486
Kind Code:
A1
Abstract:
An epoxy resin composition for semiconductor encapsulation which comprises (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) an oxidized polyethylene wax having a dropping point of 60 to 140°C, acid value of 10 to 100 mg-KOH/g, number-average molecular weight of 500 to 20,000, and average particle diameter of 5 to 100 µm, wherein at least either of the epoxy resin (A) and the phenolic resin (B) is a resin of a novolak structure having a biphenylene group in the main chain and the oxidized polyethylene wax (E) is contained in an amount of 0.01 to 1 wt.% based on the whole epoxy resin composition.
Inventors:
KURODA HIROFUMI (JP)
Application Number:
PCT/JP2004/000283
Publication Date:
August 05, 2004
Filing Date:
January 16, 2004
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
KURODA HIROFUMI (JP)
KURODA HIROFUMI (JP)
International Classes:
C08L63/00; H01L23/29; C08L23/30; C08L61/06; C08L91/06; (IPC1-7): C08L63/00
Foreign References:
| JP2001247748A | 2001-09-11 | |||
| JP2001172473A | 2001-06-26 | |||
| JP2002284969A | 2002-10-03 | |||
| JPH0873703A | 1996-03-19 | |||
| JPH11152393A | 1999-06-08 | |||
| JP2002284853A | 2002-10-03 | |||
| JPH10324791A | 1998-12-08 | |||
| JP2002356538A | 2002-12-13 | |||
| JP2003064239A | 2003-03-05 | |||
| JP2003212957A | 2003-07-30 | |||
| JP2000017150A | 2000-01-18 | |||
| JP2001329051A | 2001-11-27 | |||
| JP2003064159A | 2003-03-05 |
Attorney, Agent or Firm:
Hayami, Shinji (Ebisu-nishi Shibuya-ku, Tokyo 21, JP)
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