Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2005/037888
Kind Code:
A1
Abstract:
Disclosed is an epoxy resin composition for sealing semiconductors which is characterized by containing (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a triazole compound. The epoxy resin composition for sealing semiconductors preferably contains a triazole compound which is represented by the following general formula (1); (wherein R1 represents a hydrogen atom, or a mercapto group, an amino group, a hydroxyl group or a hydrocarbon chain with 1-8 carbon atoms having such a functional group at the end.)
Inventors:
NISHITANI YOSHINORI (JP)
Application Number:
PCT/JP2004/015432
Publication Date:
April 28, 2005
Filing Date:
October 19, 2004
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
NISHITANI YOSHINORI (JP)
NISHITANI YOSHINORI (JP)
International Classes:
C08G59/40; C08G59/68; C08L63/00; H01L23/29; C08L61/06; (IPC1-7): C08G59/40
Foreign References:
| JPS58198525A | 1983-11-18 | |||
| JP2001106768A | 2001-04-17 | |||
| JPS62161820A | 1987-07-17 | |||
| JPS54152100A | 1979-11-29 | |||
| JPH1129695A | 1999-02-02 | |||
| JPS54139998A | 1979-10-30 |
Attorney, Agent or Firm:
Hayami, Shinji (2-17-16 Ebisu-Nish, Shibuya-ku Tokyo 21, JP)
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