Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2005/087833
Kind Code:
A1
Abstract:
An epoxy resin composition for semiconductor sealing that contains no hazardous substances out of regard for environment and excels in soldering heat resistance at the time of mounting and further in productivity; and a semiconductor device including sealing thereby. There is provided an epoxy resin composition for semiconductor sealing, characterized in that not only are an epoxy resin of given structure (A) and a phenolic resin of given structure (B) contained as main components but also a phenolic resin wherein the area ratio of a component having three or less aromatic rings per molecule in GPC analysis is 0.8% or less is contained as an essential component. Further, there is provided a semiconductor device characterized in that it comprises a semiconductor element sealed with the epoxy resin composition.
Inventors:
NIKAIDO HIROKI (JP)
KURODA HIROFUMI (JP)
KURODA HIROFUMI (JP)
Application Number:
PCT/JP2005/002049
Publication Date:
September 22, 2005
Filing Date:
February 10, 2005
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
NIKAIDO HIROKI (JP)
KURODA HIROFUMI (JP)
NIKAIDO HIROKI (JP)
KURODA HIROFUMI (JP)
International Classes:
B32B27/38; C08G59/20; C08G59/32; C08G59/62; C08L61/06; C08L63/00; H01L21/56; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08G59/20; H01L23/29; H01L23/31
Foreign References:
| JP2005059486A | 2005-03-10 | |||
| JP2003292574A | 2003-10-15 | |||
| JP2002348350A | 2002-12-04 | |||
| JP2003261746A | 2003-09-19 | |||
| JP2003261646A | 2003-09-19 | |||
| JP2001329051A | 2001-11-27 | |||
| JP2003113225A | 2003-04-18 | |||
| JP2000034393A | 2000-02-02 |
Attorney, Agent or Firm:
Hayami, Shinji (2-17-16 Ebisu-Nish, Shibuya-ku Tokyo 21, JP)
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