EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE COMPRISING SAME

WIPO Patent Application WO/2019/022390

A1

The present invention provides: an epoxy resin composition comprising an epoxy resin, a curing agent, a coupling agent, a curing accelerator, and an adhesion improver, the adhesion improver containing an imidazole-based compound having an average particle size of 0.1-5 ㎛; and a semiconductor device comprising the same. The epoxy resin composition of the present invention has high adhesion with a different kind of material, such as copper, nickel, or silver, and thus can satisfy a high level of reliability required for a semiconductor for a car, such as MSL or TCT.

JP2023140277	ESTER COMPOUND, METHOD FOR PRODUCING THE SAME, THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE SHEET
JP2006502285	Solvent-type two-component modified epoxy-aminosilane coating composition
JP2015209516	CURABLE COMPOSITION, AND CURED PRODUCT

PARK JI SEUNG (KR)
PARK CHAN YOUNG (KR)
SHIM MYOUNG TAEK (KR)
JEON KI YOUNG (KR)
LEE SANG SUN (KR)

PCT/KR2018/007381

January 31, 2019

June 29, 2018

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KCC CORP (KR)

C08G59/02; C08G59/62; C08K3/017; C08K5/14; C08K5/3445; C08K5/3492; C08K5/5313; C08K5/5415; H01L23/29

KR100797967B1	2008-01-24
KR20010050115A	2001-06-15
KR20150015317A	2015-02-10
CN1256288A	2000-06-14
KR860001555B1	1986-10-04
KR20130094970A	2013-08-27

See also references of EP 3660068A4

SUNGAM SUH INTERNATIONAL PATENT & LAW FIRM (KR)

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