Title:
EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/075342
Kind Code:
A1
Abstract:
Provided are an epoxy resin composition whereby it is possible to achieve both injectability and reliability, a semiconductor device, and a method for producing the semiconductor device. The epoxy resin composition contains a polyalkylene glycol epoxy resin, a heterocyclic compound including a nitrogen atom, and a filler. The content of the filler is 55 mass% or more and less than 77 mass% with respect to the total amount of the epoxy resin composition.
Inventors:
KAJIWARA MASASHI (JP)
Application Number:
PCT/JP2023/022302
Publication Date:
April 11, 2024
Filing Date:
June 15, 2023
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L63/00; C08G59/22; C08K3/013; C08K5/3445; C08K5/3492; H01L23/29; H01L23/31
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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