Title:
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2004/096911
Kind Code:
A1
Abstract:
An epoxy resin composition for semiconductor encapsulation is disclosed which essentially contains an epoxy resin, a phenol resin, an inorganic filler, a curing accelerator, and a carbon precursor having an electric specific resistance within the semiconductor range that is not less than 1 × 102 &ohm ·cm but less than 1 × 107 &ohm ·cm. The inorganic filler is contained in an amount of 65-92% by weight and the carbon precursor is contained in an amount of 0.1-5.0% by weight, to the total epoxy resin composition. By using such an epoxy resin composition, an excellent YAG laser markability can be attained while preventing electric defects such as short-circuit of wiring and leakage current generation and metal wiring deformation.
Inventors:
MAEDA MASAKATSU (JP)
Application Number:
PCT/JP2004/005773
Publication Date:
November 11, 2004
Filing Date:
April 22, 2004
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
MAEDA MASAKATSU (JP)
MAEDA MASAKATSU (JP)
International Classes:
C08L63/00; H01L23/29; C08L61/06; (IPC1-7): C08L63/00
Foreign References:
| JP2002348439A | 2002-12-04 | |||
| JP2001247747A | 2001-09-11 |
Attorney, Agent or Firm:
Akatsuka, Kenji (5F 1-16, Kanda Suda-ch, Chiyoda-ku Tokyo 41, JP)
Download PDF: