EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

Title:

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2006/095914

Kind Code:

A1

Abstract:

Disclosed is an epoxy resin composition for semiconductor encapsulation comprising an epoxy resin (A), a phenol resin (B), an inorganic filler (C), a curing accelerator (D) and a surface-treated coloring agent (E) wherein the coloring agent before surface treatment is composed of a carbon precursor having a carbon content of not less than 90% by weight or a carbon black having a DBP absorption of not less than 100 cm³/100g. Also disclosed is a semiconductor device encapsulated by using such an epoxy resin composition. This epoxy resin composition for semiconductor encapsulation exhibits excellent laser marking properties without causing short-circuits of wiring, electrical defects such as leakage defects, or wire deformation.

More Like This:

JPH02173056	HARDENABLE COMPOSITION AND INTEGRATED CIRCUIT MODULE USING IT
JPH03197529	EPOXY RESIN MOLDING MATERIAL FOR SEMICONDUCTOR SEALING
JPS5243836	ELECTRO-CONDUCTIVE ADHESIVE

Inventors:

NISHIKAWA ATSUNORI (JP)

Application Number:

PCT/JP2006/305177

Publication Date:

September 14, 2006

Filing Date:

March 09, 2006

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SUMITOMO BAKELITE CO (JP)
NISHIKAWA ATSUNORI (JP)

International Classes:

C08L63/00; C08K3/04; C08K9/02; C09C1/56; H01L23/29; H01L23/31

Foreign References:

JP2004263091A	2004-09-24
JP2002348439A	2002-12-04
JP2001302886A	2001-10-31
JP2005002272A	2005-01-06

Attorney, Agent or Firm:

Akatsuka, Kenji (1-16 Kanda Suda-ch, Chiyoda-ku Tokyo, JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: FUEL JETTING CONTROL UNIT FOR INTERNAL COMBUSTION ENGINE

Next Patent: MULTILAYER WIRING STRUCTURE, SEMICONDUCTOR DEVICE, PATTERN TRANSFER MASK AND METHOD FOR MANUFACTURIN...