EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR MOLDING, AND MOLDING FILM AND SEMICONDUCTOR PACKAGE USING SAME

Title:

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR MOLDING, AND MOLDING FILM AND SEMICONDUCTOR PACKAGE USING SAME

Document Type and Number:

WIPO Patent Application WO/2019/139354

Kind Code:

A1

Abstract:

The present invention relates to an epoxy resin composition for semiconductor molding, which has excellent heat resistance and mechanical properties and has a low thermal expansion coefficient and thus exhibits an improved bending property, and has an improved visibility, and a molding film and a semiconductor package using the epoxy resin composition for semiconductor molding.

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Inventors:

JEONG MINSU (KR)
KYUNG YOU JIN (KR)
CHOI BYUNG JU (KR)
JEONG WOO JAE (KR)
LEE KWANG JOO (KR)
CHO EUNBYURL (KR)

Application Number:

PCT/KR2019/000353

Publication Date:

July 18, 2019

Filing Date:

January 09, 2019

Export Citation:

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Assignee:

LG CHEMICAL LTD (KR)

International Classes:

C08L63/00; C08G59/14; C08J5/18; C08K3/013; C08K3/36; H01L23/29

Foreign References:

JP2005171187A	2005-06-30
JP2016191031A	2016-11-10
KR20130118298A	2013-10-29
JP2004083764A	2004-03-18
JP2004339292A	2004-12-02

Other References: