Title:
EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, C-STAGE SHEET, CURED OBJECT, METAL FOIL WITH RESIN, AND METALLIC SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/145413
Kind Code:
A1
Abstract:
An epoxy resin composition which comprises an epoxy resin, a hardener, and a filler, wherein the filler comprises a nitride filler and the epoxy resin comprises one or more polymer compounds each having at least one structural unit selected from the group consisting of structural units represented by general formula (IA) and structural units represented by general formula (IB), the polymer compounds including a dimer compound having, in the molecule, two structural units represented by general formula (II), the dimer compound accounting for 15-28 mass% of the whole epoxy resin.
Inventors:
KIGUCHI KAZUYA (JP)
NISHIYAMA TOMOO (JP)
KATAGI HIDEYUKI (JP)
TAKEZAWA YOSHITAKA (JP)
AMANO YOSHIHIRO (JP)
TANAKA KENJI (JP)
SUE HARUAKI (JP)
KOSUGI SHINICHI (JP)
YOSHIDA YUKA (JP)
NISHIYAMA TOMOO (JP)
KATAGI HIDEYUKI (JP)
TAKEZAWA YOSHITAKA (JP)
AMANO YOSHIHIRO (JP)
TANAKA KENJI (JP)
SUE HARUAKI (JP)
KOSUGI SHINICHI (JP)
YOSHIDA YUKA (JP)
Application Number:
PCT/JP2016/074882
Publication Date:
August 31, 2017
Filing Date:
August 25, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/24; C08K3/22; C08K3/28; C08K3/36; C08K5/54; C08L61/04; C08L63/00
Domestic Patent References:
| WO2002094905A1 | 2002-11-28 |
Foreign References:
| JP2013234313A | 2013-11-21 | |||
| JP2013227451A | 2013-11-07 | |||
| JP2004010762A | 2004-01-15 | |||
| JP2004161909A | 2004-06-10 | |||
| JP2002226550A | 2002-08-14 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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