Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, C-STAGE SHEET, CURED PRODUCT, METAL FOIL WITH RESIN, METAL SUBSTRATE, AND POWER SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/176074
Kind Code:
A1
Abstract:
This epoxy resin has a mesogenic structure and a siloxane structure. This epoxy resin composition contains: an epoxy resin having a mesogenic structure and a siloxane structure; and a curing agent.

More Like This:
JPH02111950PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT
JP6306483Curable epoxy resin composition
JPH05140270CURABLE RESIN COMPOSITION
Inventors:
KIGUCHI KAZUYA (JP)
NISHIYAMA TOMOO (JP)
FUJIMOTO DAISUKE (JP)
SAKAMOTO NORIHIKO (JP)
Application Number:
PCT/JP2018/010347
Publication Date:
September 19, 2019
Filing Date:
March 15, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/20; B32B15/092; C08J5/18; C08J5/24; C08K3/00; C08K3/013; C08L63/00; H01L23/36
Domestic Patent References:
WO2013065159A12013-05-10
Foreign References:
JP2008214599A2008-09-18
JP2015048400A2015-03-16
JPH09118673A1997-05-06
JP2018003008A2018-01-11
US5138010A1992-08-11
JP4118691B22008-07-16
JP4619770B22011-01-26
JP2011084557A2011-04-28
JP2011098952A2011-05-19
JP5471975B22014-04-16
JP3759208B22006-03-22
Other References:
See also references of EP 3766911A4
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: STAINLESS STEEL MATERIAL FOR USE IN DIFFUSION BONDING JIGS

Next Patent: WORK MACHINE