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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION, RESIN SHEET, CURED ARTICLE, AND PHENOXY RESIN
Document Type and Number:
WIPO Patent Application WO/2013/161606
Kind Code:
A1
Abstract:
An epoxy resin composition comprises: (i) an epoxy resin; (ii) a curing agent; and (iii) a non-crystalline phenoxy resin which is represented by general formula (1) [wherein X represents a biphenylene skeleton represented by formula (2) (wherein R1 to R8 independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms) or a naphthalene skeleton represented by formula (3); Y represents a biphenylene skeleton represented by formula (2); Z represents a hydrogen atom or a glycidyl group; and n represents the number of repeating units] and has a weight average molecular weight falling within the range from 10,000 to 200,000. The component (i) contains a crystalline epoxy resin having a mesogenic group in an amount falling within the range from 5 to 100 wt% relative to the total amount of the component (i).

Inventors:
NAKANISHI TETSUYA (JP)
TAUCHI SHIGEAKI (JP)
Application Number:
PCT/JP2013/061178
Publication Date:
October 31, 2013
Filing Date:
April 15, 2013
Export Citation:
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Assignee:
NIPPON STEEL & SUMIKIN CHEM CO (JP)
International Classes:
C08G59/20; C08L63/00; C08L71/10
Foreign References:
JP2011241245A2011-12-01
JP2006176658A2006-07-06
JP2006036801A2006-02-09
JP2012131992A2012-07-12
JP2012116936A2012-06-21
JP2010001427A2010-01-07
JP2004002573A2004-01-08
Attorney, Agent or Firm:
WATANABE Kazuhiro et al. (JP)
Kazuhiro Watanabe (JP)
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