Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
EPOXY RESIN, RESIN COMPOSITION, RESIN SHEET, RESIN CURED PRODUCT, RESIN SUBSTRATE AND MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/203449
Kind Code:
A1
Abstract:
An epoxy resin which has, between end groups arranged at both ends and each having an epoxy group, a first structure wherein an aromatic ring group, an ether oxygen atom, a methylene group, an aromatic ring group, a methylene group, an ether oxygen atom and an aromatic ring group are sequentially bonded in this order, and/or a second structure wherein an aromatic ring group, a methylene group, an ether oxygen atom, an aromatic ring group, an ether oxygen atom, a methylene group and an aromatic ring group are sequentially bonded in this order.

Inventors:
INAGAKI TAKASHI (JP)
SATO AYANO (JP)
Application Number:
PCT/JP2020/012943
Publication Date:
October 08, 2020
Filing Date:
March 24, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TDK CORP (JP)
International Classes:
C08G59/06; C08G59/20; H05K1/03; H05K1/05
Domestic Patent References:
WO2009060897A12009-05-14
Foreign References:
JP2010229260A2010-10-14
JP2015174975A2015-10-05
JP2014111712A2014-06-19
JP2001329044A2001-11-27
JPS6241222A1987-02-23
JP2005029788A2005-02-03
JP2015057465A2015-03-26
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Download PDF:



 
Previous Patent: DECORATIVE MATERIAL

Next Patent: PULVERIZER