Title:
EPOXY RESIN COMPOSITION, RESIN SHEET, PREPREG AND METAL-CLAD LAMINATED SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/017749
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an epoxy resin composition capable of forming a resin board in which warping, which may occur in a heating step of a board manufacturing process and/or a mounting process, is suppressed, a resin sheet, a prepreg, a metal-clad laminated sheet, a printed circuit board, and a semiconductor device which are obtained using said epoxy resin composition. The epoxy resin composition according to the present invention includes, as essential components, an epoxy resin represented by the following general formula (1) and a cyanate ester compound having two or more cyanato groups in its molecule. (In the formula, the ratio of (a) to (b), i.e., (a)/(b)=1-3. G represents a glycidyl group. n is 0-5, which is the number of repetitions.)
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Inventors:
NAKANISHI MASATAKA (JP)
HASEGAWA ATSUHIKO (JP)
EBARA SEIJI (JP)
HASEGAWA ATSUHIKO (JP)
EBARA SEIJI (JP)
Application Number:
PCT/JP2015/071630
Publication Date:
February 04, 2016
Filing Date:
July 30, 2015
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G59/40; C08G59/32; C08J5/24; H05K1/03
Domestic Patent References:
| WO2011132674A1 | 2011-10-27 |
Foreign References:
| JP2013043958A | 2013-03-04 | |||
| JP2011246612A | 2011-12-08 | |||
| JPH07292066A | 1995-11-07 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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