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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION AND STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/083885
Kind Code:
A1
Abstract:
The epoxy resin composition according to the present invention comprises an epoxy resin, a hardener, an inorganic filler, and a hardening accelerator. When heated from 30°C to 200°C under the conditions of a heating rate of 10 °C/min using a differential scanning calorimeter, the epoxy resin composition gives a DSC curve which has a maximum exothermic-peak temperature of 80-145°C.

Inventors:
MAEDA SHIGEYUKI (JP)
Application Number:
PCT/JP2017/032806
Publication Date:
May 11, 2018
Filing Date:
September 12, 2017
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08L63/00; C08G59/62; C08K3/00; C08K5/13; C08K5/3445; C08K7/18
Foreign References:
JP2001226463A2001-08-21
JPH08164532A1996-06-25
JP2008081684A2008-04-10
JP2008081685A2008-04-10
JP2015086359A2015-05-07
JP2015137344A2015-07-30
JP2009235211A2009-10-15
JP2016084342A2016-05-19
JP2016214890A2016-12-22
Other References:
See also references of EP 3536745A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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