Title:
EPOXY RESIN COMPOSITION FOR USE IN SEALING OF SEMICONDUCTORS, AND SEMICONDUCTOR-PACKAGED STRUCTURE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2015/045422
Kind Code:
A1
Abstract:
An epoxy resin composition for use in the sealing of semiconductors, which comprises (A) 100 parts by mass of an epoxy resin containing 10 to 45% by mass of a novolac-type epoxy resin, (B) 50 to 150 parts by mass of an acid anhydride, (C) 2 to 12 parts by mass of a curing accelerator, (D) 5 to 50 parts by mass of a silicone gel or a silicone oil and (E) spherical fused silica having an average particle diameter of 2 to 30 μm, wherein the content of the fused silica (E) is 80 to 92% by mass and the viscosity of the epoxy resin composition is 1000 Pa·s or less at 25ºC and a shear rate of 2.5 (1/s).
Inventors:
KITAGAWA TAKEYUKI
FUJII YASUHITO
KAN KATSUSHI
FUJII YASUHITO
KAN KATSUSHI
Application Number:
PCT/JP2014/004986
Publication Date:
April 02, 2015
Filing Date:
September 30, 2014
Export Citation:
Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C08L63/00; C08K3/36; C08K5/00; C08K5/09; H01L23/29; H01L23/31; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2009142065A1 | 2009-11-26 |
Foreign References:
| JPH1095835A | 1998-04-14 | |||
| JP2012069879A | 2012-04-05 | |||
| JP2013010940A | 2013-01-17 | |||
| JP2013253135A | 2013-12-19 | |||
| JP2012209453A | 2012-10-25 | |||
| JP2013010940A | 2013-01-17 | |||
| JP2011195742A | 2011-10-06 | |||
| JPS5448720A | 1979-04-17 | |||
| JPS4817847A | ||||
| JP3855074B2 | 2006-12-06 |
Other References:
See also references of EP 3042932A4
Attorney, Agent or Firm:
KAWASAKI, SHINICHI (JP)
Shin-ichi Kawasaki (JP)
Shin-ichi Kawasaki (JP)
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