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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION WITH EXCELLENT MOLDABILITY AND METAL COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2013/019092
Kind Code:
A3
Abstract:
The present invention relates to: an epoxy resin composition which comprises (a) at least one epoxy resin selected from the group consisting of bisphenol A-, bisphenol F-, cresol novolac-, dicyclopentadiene-, trisphenylmethane-, naphthalene-, and biphenyl-type epoxy resins, and hydrogenated epoxy resin thereof, (b) a dimer acid -modified epoxy resin or a urethane-modified epoxy resin, (c) a curing agent, (d) a curing accelerator, and (e) an inorganic filler, wherein, based on 100 parts by weight of a mixture of the epoxy resin and the curing agent, the dimer acid -modified epoxy resin or the urethane-modified epoxy resin is included in the amount of 5-40 parts by weight, the curing accelerator is included in the amount of 0.005-0.05 parts by weight, and the inorganic filler is included in the amount of 200-400 parts by weight; and a metal copper clad laminate for a printed circuit board including an insulating layer formed using the epoxy resin composition.

Inventors:
LEE HANG SEOK (KR)
PARK KWANG SUK (KR)
PARK IL GEUN (KR)
KIM IN WOOK (KR)
Application Number:
PCT/KR2012/006218
Publication Date:
June 13, 2013
Filing Date:
August 06, 2012
Export Citation:
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Assignee:
DOOSAN CORP (KR)
LEE HANG SEOK (KR)
PARK KWANG SUK (KR)
PARK IL GEUN (KR)
KIM IN WOOK (KR)
International Classes:
C08L63/00; B32B15/08; C08G59/18; C08K3/00
Foreign References:
JPH04185631A1992-07-02
JP2001270976A2001-10-02
JP2008189852A2008-08-21
JP2003268075A2003-09-25
Attorney, Agent or Firm:
KIM, Kee Hyo (Kukdong Building 60-1,Chungmuro3-ka, Chung-ku, Seoul 100-705, KR)
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Claims: