Title:
EPOXY RESIN COMPOSITION WITH EXCELLENT MOLDABILITY AND METAL COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2013/019092
Kind Code:
A3
Abstract:
The present invention relates to: an epoxy resin composition which comprises (a) at least one epoxy resin selected from the group consisting of bisphenol A-, bisphenol F-, cresol novolac-, dicyclopentadiene-, trisphenylmethane-, naphthalene-, and biphenyl-type epoxy resins, and hydrogenated epoxy resin thereof, (b) a dimer acid -modified epoxy resin or a urethane-modified epoxy resin, (c) a curing agent, (d) a curing accelerator, and (e) an inorganic filler, wherein, based on 100 parts by weight of a mixture of the epoxy resin and the curing agent, the dimer acid -modified epoxy resin or the urethane-modified epoxy resin is included in the amount of 5-40 parts by weight, the curing accelerator is included in the amount of 0.005-0.05 parts by weight, and the inorganic filler is included in the amount of 200-400 parts by weight; and a metal copper clad laminate for a printed circuit board including an insulating layer formed using the epoxy resin composition.
Inventors:
LEE HANG SEOK (KR)
PARK KWANG SUK (KR)
PARK IL GEUN (KR)
KIM IN WOOK (KR)
PARK KWANG SUK (KR)
PARK IL GEUN (KR)
KIM IN WOOK (KR)
Application Number:
PCT/KR2012/006218
Publication Date:
June 13, 2013
Filing Date:
August 06, 2012
Export Citation:
Assignee:
DOOSAN CORP (KR)
LEE HANG SEOK (KR)
PARK KWANG SUK (KR)
PARK IL GEUN (KR)
KIM IN WOOK (KR)
LEE HANG SEOK (KR)
PARK KWANG SUK (KR)
PARK IL GEUN (KR)
KIM IN WOOK (KR)
International Classes:
C08L63/00; B32B15/08; C08G59/18; C08K3/00
Foreign References:
JPH04185631A | 1992-07-02 | |||
JP2001270976A | 2001-10-02 | |||
JP2008189852A | 2008-08-21 | |||
JP2003268075A | 2003-09-25 |
Attorney, Agent or Firm:
KIM, Kee Hyo (Kukdong Building 60-1,Chungmuro3-ka, Chung-ku, Seoul 100-705, KR)
Download PDF:
Claims: