Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/034713
Kind Code:
A1
Abstract:
An epoxy resin composition excellent in curability, adhesiveness, heat resistance, sanitariness, weather resistance, corrosion resistance, storage stability, and so on, which comprises an epoxy resin and a nonphotosensitive curing agent, characterized in that the epoxy resin is a compound represented by the general formula (1).
Inventors:
SASA NOBUMASA (JP)
Application Number:
PCT/JP2006/318106
Publication Date:
March 29, 2007
Filing Date:
September 13, 2006
Export Citation:
Assignee:
KONICA MINOLTA MED & GRAPHIC (JP)
SASA NOBUMASA (JP)
SASA NOBUMASA (JP)
International Classes:
C08G59/24; C09D163/00; C09J163/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2003064530A1 | 2003-08-07 |
Foreign References:
| JP2004315778A | 2004-11-11 | |||
| JP2004339267A | 2004-12-02 | |||
| JP2004204228A | 2004-07-22 | |||
| JP2006089715A | 2006-04-06 |
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