Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/002008
Kind Code:
A1
Abstract:
Disclosed is an epoxy resin composition having good ejectability, which loses fluidity when heated even though the composition has not been cured by energy ray irradiation, and maintains the resin shape right after ejection still after the heat curing. The epoxy resin composition contains the following members as essential components.
Component (A): an epoxy compound
Component (B): an epoxy compound into which a (meth)acrylic group is partially introduced
Component (C): a (meth)acrylic compound
Component (D): an amine curing agent
Component (E): a photoinitiator
Inventors:
ANRAKU TOSHIHIKO (JP)
INOUE MANABU (JP)
INOUE MANABU (JP)
Application Number:
PCT/JP2009/062235
Publication Date:
January 07, 2010
Filing Date:
June 29, 2009
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
ANRAKU TOSHIHIKO (JP)
INOUE MANABU (JP)
ANRAKU TOSHIHIKO (JP)
INOUE MANABU (JP)
International Classes:
C08G59/17; C08F299/00; C09J4/02; C09J11/06; C09J163/00
Foreign References:
| JP2006106385A | 2006-04-20 | |||
| JPH05295087A | 1993-11-09 | |||
| JP2004126211A | 2004-04-22 | |||
| JP2004137321A | 2004-05-13 | |||
| JP2003026765A | 2003-01-29 |
Attorney, Agent or Firm:
SAITO, Takehiko (3-6 Akasaka 1-chom, Minato-ku Tokyo 52, JP)
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