Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/057019
Kind Code:
A1
Abstract:
The present invention provides an epoxy resin composition which is able to be thermally cured at a low temperature around 100°C or less in a short time around 10 minutes or less, while having excellent bonding strength and excellent pot life. An epoxy resin composition according to the present invention is characterized by containing (A) an epoxy resin, (B) a thiol-based curing agent and (C) an isocyanate adduct-type microencapsulated curing accelerator that contains, as an active ingredient, 1,4-diazabicyclo[2.2.2]octane (DABCO), and is also characterized in that: the ratio (mass ratio) of an aromatic epoxy resin to an aliphatic epoxy resin in the epoxy resin serving as the component (A) is from 10:0 to 2:8; and the amount of DABCO in the component (C) is 0.01-2 parts by mass relative to 100 parts by mass of the total of the components (A)-(C).
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Inventors:
IWAYA KAZUKI (JP)
IMAI KAZUNARI (JP)
IMAI KAZUNARI (JP)
Application Number:
PCT/JP2016/077245
Publication Date:
April 06, 2017
Filing Date:
September 15, 2016
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G59/66; C08G59/56; C09J11/06; C09J163/00; H01L21/52
Domestic Patent References:
| WO2015141347A1 | 2015-09-24 | |||
| WO2014066041A2 | 2014-05-01 | |||
| WO2015080241A1 | 2015-06-04 | |||
| WO2016143815A1 | 2016-09-15 |
Foreign References:
| JP2014152236A | 2014-08-25 | |||
| JP2015093887A | 2015-05-18 | |||
| JPH11256013A | 1999-09-21 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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