Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/131567
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition that has a low dielectric loss tangent while maintaining excellent adhesiveness. Specifically, the present invention provides an epoxy resin composition that contains a specific epoxy resin and a phenol-based curing agent.
Inventors:
HARISAKI RYOTA (JP)
FUKUDA NORIAKI (JP)
YAMAMOTO KATSUMASA (JP)
FUKUDA NORIAKI (JP)
YAMAMOTO KATSUMASA (JP)
Application Number:
PCT/JP2018/000198
Publication Date:
July 19, 2018
Filing Date:
January 09, 2018
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08G59/20; C08G59/62; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2017010401A1 | 2017-01-19 | |||
| WO2017086368A1 | 2017-05-26 |
Foreign References:
| JP2016069548A | 2016-05-09 | |||
| JP2012001668A | 2012-01-05 | |||
| US3445483A | 1969-05-20 | |||
| JP2007254709A | 2007-10-04 | |||
| GB1123960A | 1968-08-14 |
Other References:
See also references of EP 3569627A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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