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Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/131569
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition having excellent electrical characteristics (especially a low dielectric loss tangent) and being capable of achieving high adhesion to metal.　Specifically, an epoxy resin composition containing an active ester compound and an epoxy resin having a specific structure is provided.

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Inventors:
FUKUDA NORIAKI (JP)
HARISAKI RYOTA (JP)
YAMAMOTO KATSUMASA (JP)
Application Number:
PCT/JP2018/000200
Publication Date:
July 19, 2018
Filing Date:
January 09, 2018
Export Citation:
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Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08G59/32; C08G59/42; C09D5/25; C09D7/40; C09D163/00; C09J11/06; C09J163/00; C09K3/10; H01L21/312; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
WO2015041325A12015-03-26
WO2017010401A12017-01-19
WO2017086368A12017-05-26
WO2013061688A12013-05-02
Foreign References:
JP2008505945A2008-02-28
JP2004527602A2004-09-09
JP2003519705A2003-06-24
JP2012001668A2012-01-05
JP2017019983A2017-01-26
JP2016117904A2016-06-30
JP2004277460A2004-10-07
GB1123960A1968-08-14
JP2009235165A2009-10-15
Other References:
See also references of EP 3569628A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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