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Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/131570
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition capable of achieving excellent low dielectric properties and high adhesion to metal. Specifically, an epoxy resin composition is provided that contains organic particles and an epoxy resin having a specific structure.

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Inventors:
FUKUDA NORIAKI (JP)
HARISAKI RYOTA (JP)
YAMAMOTO KATSUMASA (JP)
Application Number:
PCT/JP2018/000202
Publication Date:
July 19, 2018
Filing Date:
January 09, 2018
Export Citation:
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Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08L63/00; C08G59/32; C09D5/25; C09D7/40; C09D163/00; C09J11/08; C09J163/00; C09K3/10; H01L21/312; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
WO2015041325A12015-03-26
WO2017010401A12017-01-19
WO2017086368A12017-05-26
WO2015093281A12015-06-25
Foreign References:
JP2008505945A2008-02-28
JP2004527602A2004-09-09
JP2003519705A2003-06-24
JP2012001668A2012-01-05
JP2017019983A2017-01-26
JP2001240654A2001-09-04
GB1123960A1968-08-14
Other References:
TOMIKAZU UENO: "Open Technical Lecture", 1999, JAPAN SOCIETY OF EPOXY RESIN TECHNOLOGY, article "Elastomer modification of epoxy resin", pages: 79 - 88
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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