Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/159267
Kind Code:
A1
Abstract:
[Problem] In recent years, epoxy resin compositions are used with electronic components such as camera modules. These electronic components often use Ni-plated members from the standpoint of conductivity, but conventional epoxy resin compositions have a problem such that adhering Ni-plated members is difficult. The present invention takes the above situation into consideration, and the purpose of the present invention is to provide an epoxy resin composition that has high adhesive strength with respect to Ni members. [Solution] Provided is an epoxy resin composition for adhering electronic components, the composition containing the following components (A) to (C). Component (A) is a compound having an epoxy group, component (B) is a polystyrene-based filler having a glass-transition point of 50oC or higher, and component (C) is a component that hardens component (A).
Inventors:
THREE BOND CO LTD (JP)
MORITOKI TATSUYA (JP)
YASUKOCHI REI (JP)
MORITOKI TATSUYA (JP)
YASUKOCHI REI (JP)
Application Number:
PCT/JP2018/004634
Publication Date:
September 07, 2018
Filing Date:
February 09, 2018
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08L63/00; C09J11/08; C09J163/00; G03B17/02
Foreign References:
| JP2009158713A | 2009-07-16 | |||
| JP2009231605A | 2009-10-08 | |||
| JP2009221424A | 2009-10-01 | |||
| JP2010225625A | 2010-10-07 | |||
| JP2012142138A | 2012-07-26 | |||
| JPH03161719A | 1991-07-11 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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