Title:
EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT THEREFROM
Document Type and Number:
WIPO Patent Application WO/2022/265096
Kind Code:
A1
Abstract:
The present invention provides an epoxy resin and a curable resin composition which give cured objects having excellent heat resistance and tracking properties. The epoxy resin is represented by formula (1) and has a value obtained by dividing the epoxy equivalent (g/eq.) by the softening point (°C) of 2.0 or greater but less than 2.2. (In formula (1), the R moieties are independent and each represent a methyl group or a hydrogen atom, and n, indicating the average number of repetitions, is a real number of 1-10.)
Inventors:
NAKANISHI MASATAKA (JP)
YOSHIDA KEITA (JP)
ITAI MASAYUKI (JP)
SEKI MASATO (JP)
YOSHIDA KEITA (JP)
ITAI MASAYUKI (JP)
SEKI MASATO (JP)
Application Number:
PCT/JP2022/024317
Publication Date:
December 22, 2022
Filing Date:
June 17, 2022
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G59/08
Foreign References:
| JPH07258382A | 1995-10-09 | |||
| JPH1149766A | 1999-02-23 | |||
| JPH01252624A | 1989-10-09 | |||
| JPH01252625A | 1989-10-09 | |||
| JPH08259662A | 1996-10-08 | |||
| JP2001089546A | 2001-04-03 |
Other References:
NAKAMATA, YUKO, ET AL.: "Enhanced Thermal Resistance of Molding Resin Used for All-SiC Modules", FUJI ELECTRIC TECHNICAL REPORT: SPECIAL FEATURE: POWER SEMICONDUCTORS CONTRIBUTING TO ENERGY MANAGEMENT, vol. 89, no. 4, 30 December 2016 (2016-12-30), pages 247 - 250, XP009541952, ISSN: 2187-1817
Attorney, Agent or Firm:
KIUCHI Mitsuharu et al. (JP)
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