Title:
EPOXY RESIN, CURED BODY OF SAME AND METHOD FOR PRODUCING EPOXY RESIN
Document Type and Number:
WIPO Patent Application WO/2023/182522
Kind Code:
A1
Abstract:
The present invention provides an epoxy resin which has a skeleton represented by formula (1). In formula (1), each of R4 and R5 independently represents a hydrogen atom, an alkoxy group or -OG; * may be a binding site to be bonded with another structure; n represents an integer of 0 to 100; and G represents a glycidyl group.
Inventors:
ONO SEIGO (JP)
EGUCHI YUJI (JP)
EGUCHI YUJI (JP)
Application Number:
PCT/JP2023/012033
Publication Date:
September 28, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G59/06; C07D301/28; C07D301/30; C07D303/02; C07D303/48; C08G59/12; C08G59/24; C08G59/32
Domestic Patent References:
| WO2018119157A1 | 2018-06-28 | |||
| WO2013073519A1 | 2013-05-23 | |||
| WO2019026795A1 | 2019-02-07 |
Foreign References:
| CN114874412A | 2022-08-09 | |||
| CN114326306A | 2022-04-12 | |||
| JP2013113937A | 2013-06-10 | |||
| US9878039B1 | 2018-01-30 | |||
| JP2021028371A | 2021-02-25 | |||
| US20200055807A1 | 2020-02-20 | |||
| CN107417594A | 2017-12-01 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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