EPOXY RESIN AND CURED PRODUCT THEREOF - DAINIPPON INK & CHEMICALS

Title:

EPOXY RESIN AND CURED PRODUCT THEREOF

Document Type and Number:

WIPO Patent Application WO/2018/008414

Kind Code:

A1

Abstract:

Provided are: an epoxy resin characterized by having an extremely low dielectric constant and dielectric loss tangent; a curable resin composition containing same; a cured product thereof; a printed wiring board; and a semiconductor sealing material. An epoxy resin, a curable resin composition containing same, a cured product thereof, a printed wiring board, and a semiconductor sealing material, said epoxy resin characterized by having, as required reaction raw materials thereof: (A) an esterified product of (a1) a phenolic hydroxyl group-containing compound and (a2) an aromatic dicarboxylic acid or an acid halide thereof; and (B) a bifunctional epoxy compound.

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Inventors:

SATOU YUTAKA (JP)
KAWASAKI AKITO (JP)
OKAMOTO TATSUYA (JP)

Application Number:

PCT/JP2017/023000

Publication Date:

January 11, 2018

Filing Date:

June 22, 2017

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS (JP)

International Classes:

C08G59/02; H01L23/29; H01L23/31; H05K1/03

Foreign References:

JP2003261650A	2003-09-19
JP2002012650A	2002-01-15
JP2004155990A	2004-06-03
JP2006059999A	2006-03-02
JP2014101449A	2014-06-05
JP2004156024A	2004-06-03

Attorney, Agent or Firm:

KONO Michihiro (JP)

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