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Title:
EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER
Document Type and Number:
WIPO Patent Application WO/2023/203891
Kind Code:
A1
Abstract:
Provided are: an epoxy resin curing agent comprising a component (A-1) that is a reaction composition containing a polycondensation reaction product of an aniline derivative and formaldehyde and a component (A-2) that is a reaction composition containing a reaction product of styrene and a compound represented by general formula (1) H2N-CH2-A-CH2-NH2 (wherein A represents a 1,2-phenylene group, a 1,3-phenylene group or a 1,4-phenylene group), in which the contents of the component (A-1) and the component (A-2) in the epoxy resin curing agent are 50 to 95% by mass and 5 to 50% by mass, respectively; an epoxy resin composition; a cured product of the epoxy resin composition; a fiber-reinforced composite material; and a high-pressure gas container comprising the fiber-reinforced composite material.

Inventors:
IKEUCHI KOUSUKE (JP)
WAKAHARA DAIKI (JP)
OHNISHI NOBUYOSHI (JP)
OKADA KANA (JP)
MATSUMOTO NOBUHIKO (JP)
Application Number:
PCT/JP2023/007853
Publication Date:
October 26, 2023
Filing Date:
March 02, 2023
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G59/50; C08J5/04
Domestic Patent References:
WO2016088528A12016-06-09
Foreign References:
JP2021116404A2021-08-10
JP2009046606A2009-03-05
JP2021161327A2021-10-11
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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