Title:
EPOXY RESIN CURING AGENT
Document Type and Number:
WIPO Patent Application WO/2014/069273
Kind Code:
A1
Abstract:
Provided is an epoxy resin curing agent that comprises the compound represented by formula (1). (In formula (1), R represents a methyl group, an ethyl group, or a hydroxyl group, and n is an integer of 1 to 3.)
Inventors:
UENO SHUICHI (JP)
OGURO DAI (JP)
OGURO DAI (JP)
Application Number:
PCT/JP2013/078464
Publication Date:
May 08, 2014
Filing Date:
October 21, 2013
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C07D307/60; C08G59/42
Domestic Patent References:
| WO2006077862A1 | 2006-07-27 |
Foreign References:
| JP2008120697A | 2008-05-29 | |||
| JPH069756A | 1994-01-18 | |||
| JP2011219508A | 2011-11-04 | |||
| JPH0632872A | 1994-02-08 | |||
| JP2006206783A | 2006-08-10 |
Other References:
FUKUNISHI, KOUSHI ET AL.: "Regioselective radical addition of adamantanes to dimethyl maleate", SYNTHESIS, vol. 10, no. 10, 1988, pages 826 - 827, XP055242991
See also references of EP 2915830A4
See also references of EP 2915830A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
Yoshiyuki Inaba (JP)
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