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Title:
EPOXY RESIN, METHOD FOR PREPARING SAME, AND RESIN COMPOSITION THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/208180
Kind Code:
A1
Abstract:
Provided in the embodiments of the present application is an epoxy resin, comprising a cyclic siloxane ring and at least one group represented by formula (A) linked to a silicon atom on the cyclic siloxane ring, wherein in formula (A), Z is a substituted or unsubstituted arylene; n is an integer greater than or equal to 2. The molecular structure of the epoxy resin has both a cyclic siloxane ring and an epoxy group containing an arylene structure represented by formula (A) linked to the cyclic siloxane ring. The epoxy resin can feature low viscosity, low dielectric, low water absorption, high flexibility, and higher glass transition temperature Tg, and can be applied to the field of electronic sealed packaging as a sealed packaging material so as to effectively improve the reliability of sealed packaging.

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Inventors:
XU WEINA (CN)
LIU CHENGJIE (CN)
ZHANG PENGBO (CN)
ZHANG JUNYING (CN)
Application Number:
PCT/CN2023/091523
Publication Date:
November 02, 2023
Filing Date:
April 28, 2023
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
UNIV BEIJING CHEM TECH (CN)
International Classes:
C08G59/30; C07F7/08; C08G77/12
Foreign References:
CN109400638A2019-03-01
CN113583216A2021-11-02
CN105384912A2016-03-09
CN108290907A2018-07-17
CN113881377A2022-01-04
JPS61229886A1986-10-14
US20040122186A12004-06-24
Other References:
ZHANG PENGBO, YAO TONGJIE, XUE KANGLE, MENG XIANBIN, ZHANG JUNYING, LIU LI: "Low‐dielectric constant and viscosity tetrafunctional bio‐based epoxy resin containing cyclic siloxane blocks", JOURNAL OF APPLIED POLYMER SCIENCE, JOHN WILEY & SONS, INC., US, vol. 139, no. 20, 20 May 2022 (2022-05-20), US , XP093104124, ISSN: 0021-8995, DOI: 10.1002/app.52176
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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