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Title:
EPOXY RESIN MODIFIED POLYSTYRENE RESIN, PREPARATION METHOD THEREFOR, AND USES THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/107584
Kind Code:
A1
Abstract:
The present invention provides an epoxy resin modified polystyrene resin, a preparation method therefor, and uses thereof. The epoxy resin modified polystyrene resin has a structure represented by formula (D). In the present invention, epoxy groups are introduced into molecular chains of the polystyrene, so that a dielectric property provided by chain segments of the polystyrene is kept; meanwhile, due to the existence of the epoxy groups, the resin can be matched with any epoxy resin, can also adjust board performance by means of different curing agents, and is suitable for preparing a circuit substrate of a high-frequency electronic device.

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Inventors:
YUAN CHANE (CN)
LUO HONGYUN (CN)
Application Number:
PCT/CN2016/099124
Publication Date:
June 29, 2017
Filing Date:
September 14, 2016
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08F212/08; C08F216/14; C08F220/32; C08L25/08; C08L25/14; H05K1/03
Foreign References:
CN101643571A2010-02-10
CN101643525A2010-02-10
CN102391406A2012-03-28
CN101157739A2008-04-09
CN1884319A2006-12-27
CN101245120A2008-08-20
JP2013258201A2013-12-26
US20150147799A12015-05-28
Other References:
TANG, CHENGHUA, SYNTHESIS OF REACTION TYPE SOLUBILIZERS STYRENE-GLYCIDYL METHACRYLATE COPOLYMER AND ITS APPLICATION IN PA/PPO BLENDS, 11 December 2012 (2012-12-11)
TANG, CHENGHUA: "Synthesis of Styrene-glycidyl Methacrylate Copolymer and its Applicatior in PA/PPO Blends", CHEMICAL INDUSTRY AND ENGINERING PROGRESS, vol. 22, 28 February 2003 (2003-02-28), pages 199 - 203
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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