Title:
EPOXY RESIN, PROCESS FOR PRODUCTION THEREOF, EPOXY RESIN COMPOSITION USING SAME, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2011/074517
Kind Code:
A1
Abstract:
Provided is an epoxy resin which has a low viscosity and exhibits excellent handleability in a solid state and which has excellent performances such as heat resistance, moisture resistance and thermal conductivity. The epoxy resin is useful in various fields such as lamination, molding, casting, and adhesive bonding. Also provided are both an epoxy resin composition using the epoxy resin and a cured product. The epoxy resin is a crystalline epoxy resin that is represented by general formula (1) and exhibits an endothermic peak temperature of 100 to 150°C assignable to the melting point in the differential scanning calorimetry. Further, the epoxy resin composition comprises the epoxy resin and a curing agent as the essential components. In general formula (1), n is 0.2 to 4.0 on average; and G is a glycidyl group.
Inventors:
KAJI MASASI (JP)
OGAMI KOICHIRO (JP)
OGAMI KOICHIRO (JP)
Application Number:
PCT/JP2010/072334
Publication Date:
June 23, 2011
Filing Date:
December 13, 2010
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL CO (JP)
KAJI MASASI (JP)
OGAMI KOICHIRO (JP)
KAJI MASASI (JP)
OGAMI KOICHIRO (JP)
International Classes:
C08G59/06
Foreign References:
| JPH08239454A | 1996-09-17 | |||
| JPH08143648A | 1996-06-04 | |||
| JPH04255714A | 1992-09-10 | |||
| JPH05117350A | 1993-05-14 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
Kazuya Sasaki (JP)
Kazuya Sasaki (JP)
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