EPOXY RESIN, PRODUCTION METHOD, EPOXY RESIN COMPOSITION AND CURED PRODUCT OF SAME

WIPO Patent Application WO/2017/199831

A1

The purpose of the present invention is to provide: an epoxy resin which has excellent balance between elastic modulus at high temperatures and molding shrinkage when heated and cured; a composition; a production method; and a cured product having good heat resistance and good mechanical strength. Specifically provided are: an epoxy resin of an epoxidized product of a monoalkyldihydroxybenzene, which contains compounds detected within the range of (the peak top molecular weight of the epoxidized product of a monoalkyldihydroxybenzene + 20) to (the peak top molecular weight of the epoxidized product of a monoalkyldihydroxybenzene + 40) in an amount of 0.1-0.8% in the GPC chart; and an epoxy resin of an epoxidized product of a monoalkyl catechol, wherein the ratio of the total content of a cyclic compound having a cyclic structure that contains, as constituent atoms, two adjacent oxygen atoms derived from the monoalkyl catechol and a monoglycidyl etherified product of the monoalkyl catechol to the content of a diglycidyl etherified product of the monoalkyl catechol is within the range of 0.10 to 0.40 in the high-speed liquid chromatography.

HIROTA YOUSUKE (JP)
TANII SHOTA (JP)
HAYASHI KOJI (JP)
MORINAGA KUNIHIRO (JP)

PCT/JP2017/017801

November 23, 2017

May 11, 2017

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DAINIPPON INK & CHEMICALS (JP)

C08G59/24; C08J5/04; C08J5/18; C08J5/24; H01L23/29; H01L23/31; H05K1/03; H05K3/46

JPH11217422A	1999-08-10
JP2004182752A	2004-07-02
JP2000007757A	2000-01-11
JP2011213869A	2011-10-27
JPS62127315A	1987-06-09

KONO Michihiro (JP)

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