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Patent Searching and Data


Title:
EPOXY RESIN, PRODUCTION METHOD, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/225411
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an epoxy resin which provides excellent balance between the molding shrinkage rate during thermal curing of a composition containing the epoxy resin and heat resistance of a cured product thereof; a composition; and a cured product of the composition. Specifically, provided are: an epoxy resin which is a tetramethyl biphenol-type epoxy resin represented by structural formula (in the formula, n represents the number of repeats and is an integer of 0-5), and is characterized in that the content rate of 1,2-glycols in the resin is 0.065-0.10 meq/g; a production method for the epoxy resin; an epoxy resin composition containing the epoxy resin; a cured product of the epoxy resin composition; and use thereof.

Inventors:
HIROTA Yousuke (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
NAKAMURA Nobuya (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
AKIMOTO Gensuke (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
Application Number:
JP2018/016549
Publication Date:
December 13, 2018
Filing Date:
April 24, 2018
Export Citation:
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Assignee:
DIC CORPORATION (35-58, Sakashita 3-chome Itabashi-k, Tokyo 20, 〒1748520, JP)
International Classes:
C08G59/24; B29C70/02; B32B15/08; B32B15/092; C07D301/28; C07D303/28; H01L23/14; H01L23/29; H01L23/31
Attorney, Agent or Firm:
OGAWA Shinji (7-20 Nihonbashi 3-chome, Chuo-k, Tokyo 33, 〒1038233, JP)
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