Title:
EPOXY SILICONE RESIN AND CURABLE RESIN COMPOSITION EMPLOYING SAME
Document Type and Number:
WIPO Patent Application WO/2014/033937
Kind Code:
A1
Abstract:
Disclosed are: a thermosetting resin composition which has high hardness when cured, has excellent resistance to thermal discoloration, resistance to UV-ray discoloration, strength and flexibility, suppresses damage to a package even under reflow or a heat cycle, and is suitable in the field of electronic materials and for sealing optical semiconductors; and an epoxy silicone resin used therein. The epoxy silicone resin has an epoxy equivalent weight (g/eq) of 200 to 2000 and is represented by general formula (1), and the thermosetting resin composition contains the same. In the formula, R1 and R2 are a hydrocarbon group, E1 is an organic residue having an epoxy group, and Z is a bivalent group.
Inventors:
HASE SYUICHIRO (JP)
TAKASHIMA TOMOYUKI (JP)
TANIGUCHI YUICHI (JP)
SHRESTHA NIRANJAN KUMAR (JP)
TAKASHIMA TOMOYUKI (JP)
TANIGUCHI YUICHI (JP)
SHRESTHA NIRANJAN KUMAR (JP)
Application Number:
PCT/JP2012/072270
Publication Date:
March 06, 2014
Filing Date:
August 31, 2012
Export Citation:
Assignee:
NIPPON STEEL & SUMIKIN CHEM CO (JP)
HASE SYUICHIRO (JP)
TAKASHIMA TOMOYUKI (JP)
TANIGUCHI YUICHI (JP)
SHRESTHA NIRANJAN KUMAR (JP)
HASE SYUICHIRO (JP)
TAKASHIMA TOMOYUKI (JP)
TANIGUCHI YUICHI (JP)
SHRESTHA NIRANJAN KUMAR (JP)
International Classes:
C08G59/20; C08K3/00; C08K5/16; C08L63/00; G02B6/12; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2012093589A1 | 2012-07-12 | |||
| WO2012117929A1 | 2012-09-07 |
Foreign References:
| JP2012107113A | 2012-06-07 | |||
| JP2003277591A | 2003-10-02 | |||
| JP2009203258A | 2009-09-10 | |||
| JP2008069210A | 2008-03-27 | |||
| US2762827A | 1956-09-11 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
Kazuya Sasaki (JP)
Kazuya Sasaki (JP)
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