Title:
ESD PROTECTION FUNCTION-EQUIPPED COMPOSITE ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/013555
Kind Code:
A1
Abstract:
An ESD protection function-equipped composite electronic component that has achieved a reduced element size is provided.
Second semiconductor layers of Zener diodes (D1 to D3) are disposed in the same plane. Accordingly, while a minimum number of Zener diodes (D1 to D3) are mounted on an ESD protection function-equipped composite electronic component (100), the Zener diodes (D1 to D3) can be efficiently disposed in a limited space, whereby the structure for disposing the Zener diodes (D1 to D3) can be simplified. Thus, an ESD protection function-equipped composite electronic component (100) that has achieved a reduced element size can be provided.
Inventors:
NOMURA MASANOBU (JP)
TAKESHIMA YUTAKA (JP)
TAKESHIMA YUTAKA (JP)
Application Number:
PCT/JP2015/070757
Publication Date:
January 28, 2016
Filing Date:
July 22, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L21/822; H01C13/00; H01F17/00; H01F27/00; H01G4/33; H01G4/40; H01L21/329; H01L27/04; H01L29/861; H01L29/866; H01L29/868
Domestic Patent References:
WO2006023655A2 | 2006-03-02 |
Foreign References:
JP2013065771A | 2013-04-11 | |||
JPH11168175A | 1999-06-22 | |||
JP2003060046A | 2003-02-28 | |||
JP2014067986A | 2014-04-17 | |||
JP2007005616A | 2007-01-11 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
Yuji Yanase (JP)
Yuji Yanase (JP)
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