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Title:
ETCH RATE CONTROL
Document Type and Number:
WIPO Patent Application WO/2005/108040
Kind Code:
A1
Abstract:
A method of forming a cavity (10) in the side of a substrate (e.g., a mold plate (50) adapted to be assembled with one or more additional plates to define a mold (42) for a hook or a stem on a hook component of a touch fastener) includes forming on the substrate a layer of photoresist material (64) having a pattern of etchant-passing (63) and etchant-blocking (59) regions, and applying a chemical etchant to the substrate such that the etchant undercuts the etchant-blocking regions (59) to form a single contiguous cavity (68a,68b) within the substrate. Relative etching depth of various regions of the cavity is controlled in part by the density of etchant-passing regions in the photoresist material.

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Inventors:
CLARNER MARK A (US)
Application Number:
PCT/US2005/014751
Publication Date:
November 17, 2005
Filing Date:
April 28, 2005
Export Citation:
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Assignee:
VELCRO IND (NL)
CLARNER MARK A (US)
International Classes:
A44B18/00; B29C33/30; B29C43/22; B29C43/46; C23F1/02; (IPC1-7): B29C33/30; B29C33/38; A44B18/00; C23F1/02; B29C43/22; B29C59/02
Foreign References:
US6533981B12003-03-18
US5348616A1994-09-20
EP1017553A12000-07-12
US6163939A2000-12-26
US5922222A1999-07-13
US6224807B12001-05-01
Attorney, Agent or Firm:
Babineau, James W. (P.C. 225 Franklin Stree, Boston MA, US)
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