Title:
ETCHANT AND ETCHING METHOD FOR RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/085447
Kind Code:
A1
Abstract:
The present invention relates to an etchant for resin compositions each comprising an alkali-insoluble resin and 50-80 mass% inorganic filler, the etchant being characterized by including 15-45 mass% alkali metal hydroxide as a first ingredient and 1-40 mass% ethanolamine compound as a second ingredient and including a third ingredient, which is 3-60 mass% polyol compound, 2-20 mass% polycarboxylic acid, or 2-20 mass% hydroxy acid.
Inventors:
MIYAZAKI TAKASHI (JP)
GOKAN NORIHIKO (JP)
TANABE MASAHIRO (JP)
TOYODA YUJI (JP)
GOKAN NORIHIKO (JP)
TANABE MASAHIRO (JP)
TOYODA YUJI (JP)
Application Number:
PCT/JP2019/041765
Publication Date:
April 30, 2020
Filing Date:
October 24, 2019
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD (JP)
International Classes:
C09K13/02; C08J7/02; C08L101/00; H05K3/00
Domestic Patent References:
| WO2018186362A1 | 2018-10-11 | |||
| WO2015002272A1 | 2015-01-08 |
Foreign References:
| US20070120089A1 | 2007-05-31 | |||
| JP2010539705A | 2010-12-16 | |||
| JP2010524266A | 2010-07-15 | |||
| JP2001310959A | 2001-11-06 | |||
| JP2001358428A | 2001-12-26 | |||
| JP2006324452A | 2006-11-30 |
Attorney, Agent or Firm:
IWATANI Ryo (JP)
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