Title:
ETCHANT FOR RESIN COMPOSITION AND ETCHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/186362
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an etchant or etching method which, when used in processing for removing a resin composition comprising an alkali-insoluble resin and an inorganic filler, is capable of removing only a resin composition layer comprising said resin composition, while preventing the resin composition layer from heating up excessively to cause defects. The etchant, which is for a resin composition comprising an alkali-insoluble resin and 50-80 mass% inorganic filler, contains 15-45 mass% alkali metal hydroxide. More preferably, the etchant further contains 5-40 mass% ethanolamine compound. The etching method comprises using the etchant to remove the resin composition comprising an alkali-insoluble resin and an inorganic filler.
Inventors:
TOYODA YUJI (JP)
TANABE MASAHIRO (JP)
TANABE MASAHIRO (JP)
Application Number:
PCT/JP2018/014156
Publication Date:
October 11, 2018
Filing Date:
April 02, 2018
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD (JP)
International Classes:
C08J7/02; H05K3/06; H05K3/28
Foreign References:
| JP2006028207A | 2006-02-02 | |||
| JPS6330540A | 1988-02-09 | |||
| JP2003261699A | 2003-09-19 | |||
| JP2004504439A | 2004-02-12 | |||
| JP2000013032A | 2000-01-14 | |||
| JP2006282791A | 2006-10-19 |
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
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