Title:
ETCHING MATERIAL FOR ATOMIC LAYER ETCHING
Document Type and Number:
WIPO Patent Application WO/2020/203636
Kind Code:
A1
Abstract:
The present invention provides an etching material which contains a compound represented by general formula (1) below and is used for an atomic layer etching method. (In the formula, R1 represents a C1-C8 alkyl group.)
Inventors:
YAMASHITA ATSUSHI (JP)
YOSHINO TOMOHARU (JP)
OKADA NANA (JP)
YOSHINO TOMOHARU (JP)
OKADA NANA (JP)
Application Number:
PCT/JP2020/013639
Publication Date:
October 08, 2020
Filing Date:
March 26, 2020
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C23F1/12; H01L21/302
Foreign References:
| JP2017152689A | 2017-08-31 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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