Title:
ETCHING METHOD AND ARTICLE ETCHED MOLDED BY THAT METHOD
Document Type and Number:
WIPO Patent Application WO/2004/010577
Kind Code:
A1
Abstract:
When a tuning fork type quartz wafer (1A) having trenches (11c, 12c) in the leg parts (11, 12) is formed by etching a quartz substrate (2), a machining precision of the trenches (11c, 12c) is enhanced in terms of the depth dimension by presetting the width dimension of the trenches (11c, 12c) utilizing an etching stop technology where the etching amount depends on the shape of an etching region. The depth dimension can be attained as designed by ensuring an etching time not shorter than a minimum necessary time.
Inventors:
SATO SHUNSUKE (JP)
KODA NAOKI (JP)
FUKUTOMI SHUNSUKE (JP)
SHIRAI TAKASHI (JP)
KODA NAOKI (JP)
FUKUTOMI SHUNSUKE (JP)
SHIRAI TAKASHI (JP)
Application Number:
PCT/JP2003/008945
Publication Date:
January 29, 2004
Filing Date:
July 14, 2003
Export Citation:
Assignee:
DAISHINKU CORP (JP)
SATO SHUNSUKE (JP)
KODA NAOKI (JP)
FUKUTOMI SHUNSUKE (JP)
SHIRAI TAKASHI (JP)
SATO SHUNSUKE (JP)
KODA NAOKI (JP)
FUKUTOMI SHUNSUKE (JP)
SHIRAI TAKASHI (JP)
International Classes:
H03H3/04; H03H9/21; (IPC1-7): H03H3/02
Foreign References:
| JP2003133896A | 2003-05-09 | |||
| JP2003133895A | 2003-05-09 | |||
| JP2003017976A | 2003-01-17 | |||
| JPH09284074A | 1997-10-31 | |||
| JPH07297662A | 1995-11-10 |
Attorney, Agent or Firm:
Kurauchi, Giro (14-3 Nishitemma 4-chome, Kita-k, Osaka-shi Osaka, JP)
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