Title:
ETCHING SOLUTION COMPOSITION FOR ETCHING MOLYBDENUM/COPPER/MOLYBDENUM OR MOLYBDENUM ALLOY/COPPER/MOLYBDENUM ALLOY THREE-LAYER METAL WIRING STRUCTURE AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/047854
Kind Code:
A1
Abstract:
An etching solution composition for etching a molybdenum/copper/molybdenum or molybdenum alloy/copper/molybdenum alloy three-layer metal wiring structure and the use thereof. The etching solution composition comprises the components of hydrogen peroxide, a dihydric alcohol, an etching inhibitor, a chelating agent, an etching additive, a pH regulator and water. According to the etching liquid, not only can the decomposition of hydrogen peroxide be slowed down, but the service life of the etching solution can also be prolonged, which greatly reduces the etching solution cost during the production and manufacturing processes and improves the safety coefficient of the etching solution.
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Inventors:
LIU JING (CN)
Application Number:
PCT/CN2020/117280
Publication Date:
March 10, 2022
Filing Date:
September 24, 2020
Export Citation:
Assignee:
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
C23F1/44; C23F1/18
Foreign References:
| CN108203830A | 2018-06-26 | |||
| CN106611746A | 2017-05-03 | |||
| CN105986270A | 2016-10-05 | |||
| CN108265298A | 2018-07-10 | |||
| CN107316836A | 2017-11-03 | |||
| CN107988598A | 2018-05-04 | |||
| CN107630219A | 2018-01-26 | |||
| CN105316678A | 2016-02-10 | |||
| CN107075693A | 2017-08-18 | |||
| KR20160112472A | 2016-09-28 | |||
| KR20190111420A | 2019-10-02 | |||
| US20130270217A1 | 2013-10-17 |
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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