ETCHING SOLUTION FOR THERMOPLASTIC POLYIMIDE RESIN

Title:

ETCHING SOLUTION FOR THERMOPLASTIC POLYIMIDE RESIN

Document Type and Number:

WIPO Patent Application WO/2007/060824

Kind Code:

A1

Abstract:

Disclosed is an etching solution for a thermoplastic polyimide resin. The etching solution comprises a alkali metal hydroxide, water and ethanolamine, wherein the relationship between the content of the alkali metal hydroxide (X% by weight) and the content of water (Y% by weight) is expressed by a coordinate point falling within the range shown by the following equations [1], [2] and [3]: X > 20 [1] Y < -X + 60 [2] Y > 0.25X + 17.5 [3] wherein X and Y are defined relative to 100 of the total weight of the alkali metal hydroxide, water and ethanolamine. The etching solution can exert a good etching effect against a thermoplastic polyimide resin.

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Inventors:

OGUNI TAKASHI (JP)

Application Number:

PCT/JP2006/322079

Publication Date:

May 31, 2007

Filing Date:

November 06, 2006

Export Citation:

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Assignee:

TORAY ENG CO LTD (JP)
OGUNI TAKASHI (JP)

International Classes:

C08J7/02; G03F7/40; H05K3/00

Foreign References:

JPH1097081A	1998-04-14
JP2003082135A	2003-03-19
JP2002180044A	2002-06-26
JP2004146533A	2004-05-20

Attorney, Agent or Firm:

TSUGAWA, Tomoo (7-7 Chuo 2-chome, Joto-ku, Osaka-sh, Osaka 05, JP)

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