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Title:
ETHYLENIC POLYMER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1997/004026
Kind Code:
A1
Abstract:
An ethylenic polymer composition comprising 20 to 90 wt.% of (A) an ethylenic polymer which is an ethylene polymer or ethylene- C3-C20 'alpha'-olefin copolymer having a density (dA) of 0.96 to 0.980 g/cm3 and an intrinsic viscosity ['eta'] of 0.5 to 3.0 dl/g and 80 to 10 wt.% of (B) an ethylenic copolymer which is an ethylene polymer or ethylene- C3-C20 'alpha'-olefin copolymer having a density (dB) of 0.91 to 0.965 g/cm3 and an intrinsic viscosity ['eta'] of 1.0 to 10 dl/g, wherein at least either of the polymers (A) and (B) is one prepared by the use of a metallocene catalyst, the dA/dB ratio is larger than 1, the density lies within the range of 0.940 to 0.970 g/cm3, the MFR is 0.005 to 20 g/10 min, the MFR and melt tension (MT) satisfy the relationship: log(MT) -0.4log(MFR) + 0.7, and the die swelling ratio exceeds 1.35. This composition can give moldings excellent in mechanical strengths and stiffness.

Inventors:
KISHINE MASAHIRO (JP)
WATANABE KEIJI (JP)
TSUTSUI TOSHIYUKI (JP)
YANO KATSUNORI (JP)
Application Number:
PCT/JP1996/002072
Publication Date:
February 06, 1997
Filing Date:
July 24, 1996
Export Citation:
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Assignee:
MITSUI PETROCHEMICAL IND (JP)
KISHINE MASAHIRO (JP)
WATANABE KEIJI (JP)
TSUTSUI TOSHIYUKI (JP)
YANO KATSUNORI (JP)
International Classes:
C08F4/64; C08L23/06; C08L23/08; C08F110/02; C08F210/16; (IPC1-7): C08L23/04
Foreign References:
JPH03237145A1991-10-23
JPS59232134A1984-12-26
Other References:
See also references of EP 0783022A4
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