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Title:
EVALUATION METHOD OF POWDER FOR LAMINATE MOLDING, AND POWDER FOR LAMINATE MOLDING
Document Type and Number:
WIPO Patent Application WO/2019/038910
Kind Code:
A1
Abstract:
The present invention relates to an evaluation method of a laminate molding powder, for evaluating squeezing properties of a laminate molding powder on the basis of stable determination criteria. In this laminate molding powder evaluation method, at least the satellite adhesion ratio of the powder and the apparent density of the powder are used to evaluate the squeezing properties of the powder for laminate molding. If the satellite adhesion ratio, which is the ratio of the number of powder particles adhered as satellites, to the total number of powder particles, is less than or equal to 50% and the apparent density of the powder is greater than or equal to 3.5 g/cm3, then the powder is evaluated as being capable of forming a uniform powder layer in laminate molding. Furthermore, if the 50% particle diameter of the powder, measured with a laser diffraction method, is 3-250 µm, then the powder is evaluated as capable of forming a uniform powder layer in laminate molding.

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Inventors:
MATSUMOTO SEIICHI (JP)
SUGITANI YUJI (JP)
NISHIDA MOTONORI (JP)
Application Number:
PCT/JP2017/030510
Publication Date:
February 28, 2019
Filing Date:
August 25, 2017
Export Citation:
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Assignee:
FUKUDA METAL FOIL & POWDER CO LTD (JP)
TECH RES ASSOCIATION FUTURE ADDITIVE MANUFACTURING (JP)
International Classes:
G01N11/00; B22F1/06; B22F1/14; B22F3/16; G01N3/24
Domestic Patent References:
WO2017110445A12017-06-29
WO2016031279A12016-03-03
Foreign References:
JP2017066432A2017-04-06
JP2017127998A2017-07-27
JP2016204700A2016-12-08
JPS6140540A1986-02-26
JP2013194254A2013-09-30
JP2016172904A2016-09-29
JP2017066432A2017-04-06
Other References:
"Direct shear testing method of powder bed, Standards of APPIE", THE ASSOCIATION OF POWDER PROCESS INDUSTRY AND ENGINEERING, JAPAN, 2013, pages 1 - 5, XP055673457
See also references of EP 3674683A4
Attorney, Agent or Firm:
KATO Takashi et al. (JP)
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