Title:
EVAPORATION SOURCE FOR VACUUM DEPOSITION DEVICES
Document Type and Number:
WIPO Patent Application WO/2022/149390
Kind Code:
A1
Abstract:
Provided is an evaporation source for vacuum deposition devices which has a high deposition rate onto a deposition target and makes it possible to evaporate a large amount per unit of time when evaporating an evaporant and depositing the same onto the deposition target. This evaporation source DS for vacuum deposition devices Dm according to the present invention is positioned inside a vacuum chamber 1, and is used to evaporate a solid evaporant and deposit the same onto a deposition target, said evaporation source DS being equipped with: a crucible 4 which is capable of storing an evaporant Ms and has a discharge port 41 through which the evaporated evaporant is discharged toward the deposition target Sw; a heating means 6 capable of heating the evaporant in the crucible; and an evaporation promoter 5 provided inside the crucible in a manner such that one portion 5a thereof is immersed in the evaporant Ml, which has been melted by heating, while a gap D1 exists between the remaining portion 5b thereof and the inner surface 42 of the crucible.
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Inventors:
NAKAMURA TOSHIMITSU (JP)
ONODA JUNGO (JP)
ONODA JUNGO (JP)
Application Number:
PCT/JP2021/044812
Publication Date:
July 14, 2022
Filing Date:
December 07, 2021
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
C23C14/24; H01L51/50; H05B33/10
Foreign References:
| JPH06287748A | 1994-10-11 | |||
| CN104233196A | 2014-12-24 | |||
| JP2020190012A | 2020-11-26 | |||
| JP2021116433A | 2021-08-10 |
Attorney, Agent or Firm:
SEIGA PATENT AND TRADEMARK CORPORATION (JP)
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