EXCAVATION CHIP, EXCAVATION TOOL, AND METHOD FOR MANUFACTURING EXCAVATION CHIP

Title:

EXCAVATION CHIP, EXCAVATION TOOL, AND METHOD FOR MANUFACTURING EXCAVATION CHIP

Document Type and Number:

WIPO Patent Application WO/2017/183659

Kind Code:

A1

Abstract:

This excavation chip has a chip body provided with a distal-end part which tapers off progressively toward the distal-end side thereof, a hard layer is formed on the surface of the distal-end part of the chip body, an outermost layer of the hard layer is a cBN sintered compact having cBN particles in a ratio of 70-95 vol%, the cross-sectional structure of the outermost layer is observed to have a width of 1 nm to 30 nm and to contain Al, B, and N, and a bonded phase in which the ratio of the O content to the Al content is 0.1 or less is present between adjacent cBN particles.

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Inventors:

AKHMADI EKO WARDOYO (JP)
YANO MASAHIRO (JP)
MATSUO TOSHIHIKO (JP)
AKAHOSHI YUKI (JP)
TAKEUCHI YUICHIRO (JP)

Application Number:

PCT/JP2017/015749

Publication Date:

October 26, 2017

Filing Date:

April 19, 2017

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

E21B10/46; B22F7/00; C04B35/58; C04B41/89; E21C35/183

Foreign References:

JP2002349173A	2002-12-04
JPH02503454A	1990-10-18
JPH0616476A	1994-01-25
JP2011212832A	2011-10-27
JP2004026555A	2004-01-29

Other References: