EXHAUST GAS TREATMENT METHOD AND EXHAUST GAS TREATMENT DEVICE

WIPO Patent Application WO/2011/043374

A1

Disclosed are an exhaust gas treatment method and an exhaust gas treatment device capable of reducing the power consumed in the whole exhaust gas treatment device. Specifically disclosed is the exhaust gas treatment method which removes, by reaction, harmful gas components contained in the exhaust gas discharged from a semiconductor manufacturing device, using a solid-state removing reaction agent. The exhaust gas treatment method is characterized in that means for measuring a temperature of the removing reaction agent and means for heating the removing reaction agent are respectively provided at three or more places, along the direction of the flow of the gas, of a cylinder filled with the removing reaction agent, and that the positions of reaction zones within the cylinder filled with the removing reaction agent are detected on the basis of the temperatures measured by the respective temperature measurement means, and the respective heating means are controlled on the basis of the positions of the reaction zones.

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SUZUKI KATSUMASA (JP)
SAKODA KAORU (JP)
ISHIHARA YOSHIO (JP)
OHMI TADAHIRO (JP)
SHIRAI YASUYUKI (JP)

PCT/JP2010/067545

April 14, 2011

October 06, 2010

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TAIYO NIPPON SANSO CORP (JP)
UNIV TOHOKU (JP)
SUZUKI KATSUMASA (JP)
SAKODA KAORU (JP)
ISHIHARA YOSHIO (JP)
OHMI TADAHIRO (JP)
SHIRAI YASUYUKI (JP)

B01D53/70; B01D53/34; B01D53/46; B01D53/68

JP2002224565A	2002-08-13
JP2003080023A	2003-03-18
JP2009034671A	2009-02-19

SHIGA Masatake et al. (JP)
Masatake Shiga (JP)

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