Title:
EXPANDABLE FILM, DICING FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/042869
Kind Code:
A1
Abstract:
The present invention addresses the problem of obtaining an olefinic expandable base material that has low contamination, has a high degree of expandability, which has been insufficient in conventional olefinic expandable base materials, and makes the occurrence of necking difficult. Also addressed is obtaining a dicing film.
To address these problems, this base material contains a 1-butene·α-olefin copolymer (A) for which the tensile modulus of elasticity is 100 - 500 MPa at 23°C and a propylene elastomer composition (B) that contains a propylene·α-olefin copolymer (b1) and has a tensile modulus of elasticity of 10 - 50 MPa at 23°C. An expandable film is formed such that the propylene elastomer composition (B) content is 30 - 70 parts by weight to 100 parts by weight for the total of (A) and (B).
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Inventors:
HAYASHISHITA EIJI
OZAKI KATSUTOSHI
SAKAI MITSURU
OIKE SETSUKO
OZAKI KATSUTOSHI
SAKAI MITSURU
OIKE SETSUKO
Application Number:
PCT/JP2011/005466
Publication Date:
April 05, 2012
Filing Date:
September 28, 2011
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
HAYASHISHITA EIJI
OZAKI KATSUTOSHI
SAKAI MITSURU
OIKE SETSUKO
HAYASHISHITA EIJI
OZAKI KATSUTOSHI
SAKAI MITSURU
OIKE SETSUKO
International Classes:
H01L21/301; C09J7/29; C09J201/00
Foreign References:
| JP2009267389A | 2009-11-12 | |||
| JPH11297646A | 1999-10-29 | |||
| JP2008004836A | 2008-01-10 |
Attorney, Agent or Firm:
WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)
Koichi Washida (JP)
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Claims: