Title:
EXPANDABLE SUBSTRATE AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2019/159505
Kind Code:
A1
Abstract:
Provided is an expandable substrate (101) provided with an expandable base material (1) and a conductor pattern (6) formed on the base material (1). The base material (1) includes a particular layer. The particular layer includes a first area (31) that is a hard area extending in the particular layer and having the highest Young's modulus in the particular layer, a second area (32) extending in the particular layer and having the lowest Young's modulus in the particular layer, and a third area (33) located between the first area (31) and the second area (32) in the particular layer and having a Young's modulus that is lower than that of the first area (31) and higher than that of the second area (32). The conductor pattern (6) includes a portion spanning both the first area (31) and the second area (32) via the third area (33).
Inventors:
TAKADA RYOSUKE (JP)
Application Number:
PCT/JP2018/044901
Publication Date:
August 22, 2019
Filing Date:
December 06, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H05K1/03; H05K3/46
Domestic Patent References:
| WO2011124898A1 | 2011-10-13 |
Foreign References:
| US20120051005A1 | 2012-03-01 | |||
| JP2016076531A | 2016-05-12 | |||
| JP2014165426A | 2014-09-08 | |||
| JPH11217464A | 1999-08-10 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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